Backdrilling Solutions
Backdrilling Solutions
Retract & Sense is an advanced depth-control technology for PCB backdrilling that eliminates operator-dependent machine setup. Instead of relying on estimated layer positions, the process integrates depth control directly into the PCB design. Using precision contact sensing with the drill bit, the CNC machine can accurately detect internal copper reference layers, compensating automatically for dielectric thickness variations.
This design-driven approach enables highly consistent manufacturing with minimal process variability.
Key benefits include:
- Highly consistent stub lengths across boards and production batches
- Reduced stub length for improved signal integrity
- Elimination of operator setup errors
- Greater manufacturing reliability for high-speed PCB designs
In-Process Layer & Sliver Detection
The technology introduces two sensing methods that operate during drilling without adding extra process steps.
Layer Detection uses controlled drill contact with an internal reference layer to determine exact drilling depth. A programmed retract-and-sense motion allows the system to precisely locate the reference layer before removing the remaining via stub. This ensures accurate depth control while maintaining safe margins to signal layers.
Conductive Sliver Detection identifies unwanted copper debris created during backdrilling. By measuring electrical continuity between the drill bit and the plated hole barrel during retraction, the system can detect short circuits caused by conductive slivers in real time or during electrical testing.
Together, these capabilities provide:
- Embedded process control by design
- Reduced dielectric tolerance influence
- Improved signal consistency
- Higher product reliability
- Multi-purpose use for cavity and slot depth control
In-Process Layer & Sliver Detection
The technology introduces two sensing methods that operate during drilling without adding extra process steps.
Layer Detection uses controlled drill contact with an internal reference layer to determine exact drilling depth. A programmed retract-and-sense motion allows the system to precisely locate the reference layer before removing the remaining via stub. This ensures accurate depth control while maintaining safe margins to signal layers.
Conductive Sliver Detection identifies unwanted copper debris created during backdrilling. By measuring electrical continuity between the drill bit and the plated hole barrel during retraction, the system can detect short circuits caused by conductive slivers in real time or during electrical testing.
Together, these capabilities provide:
- Embedded process control by design
- Reduced dielectric tolerance influence
- Improved signal consistency
- Higher product reliability
- Multi-purpose use for cavity and slot depth control